JPH01109388U - - Google Patents

Info

Publication number
JPH01109388U
JPH01109388U JP1988005011U JP501188U JPH01109388U JP H01109388 U JPH01109388 U JP H01109388U JP 1988005011 U JP1988005011 U JP 1988005011U JP 501188 U JP501188 U JP 501188U JP H01109388 U JPH01109388 U JP H01109388U
Authority
JP
Japan
Prior art keywords
slider
support rod
welding head
head
slid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988005011U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0711473Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988005011U priority Critical patent/JPH0711473Y2/ja
Publication of JPH01109388U publication Critical patent/JPH01109388U/ja
Application granted granted Critical
Publication of JPH0711473Y2 publication Critical patent/JPH0711473Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988005011U 1988-01-19 1988-01-19 溶接ヘッドの加圧構造 Expired - Lifetime JPH0711473Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988005011U JPH0711473Y2 (ja) 1988-01-19 1988-01-19 溶接ヘッドの加圧構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988005011U JPH0711473Y2 (ja) 1988-01-19 1988-01-19 溶接ヘッドの加圧構造

Publications (2)

Publication Number Publication Date
JPH01109388U true JPH01109388U (en]) 1989-07-24
JPH0711473Y2 JPH0711473Y2 (ja) 1995-03-15

Family

ID=31208015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988005011U Expired - Lifetime JPH0711473Y2 (ja) 1988-01-19 1988-01-19 溶接ヘッドの加圧構造

Country Status (1)

Country Link
JP (1) JPH0711473Y2 (en])

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151182A (en) * 1980-04-25 1981-11-24 Hitachi Ltd Welding head
JPS60145290A (ja) * 1983-12-05 1985-07-31 ウエルド‐エクイツプ　ビー．ブイ 溶接ヘツド
JPS63145581U (en]) * 1987-03-18 1988-09-26

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151182A (en) * 1980-04-25 1981-11-24 Hitachi Ltd Welding head
JPS60145290A (ja) * 1983-12-05 1985-07-31 ウエルド‐エクイツプ　ビー．ブイ 溶接ヘツド
JPS63145581U (en]) * 1987-03-18 1988-09-26

Also Published As

Publication number Publication date
JPH0711473Y2 (ja) 1995-03-15

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